ALL-BOND UNIVERSAL is the ideal chemical formulation for both self-etch and total-etch adhesion

Basic characteristics:
  • Indicated for direct and indirect restorations.
  • Contains MDP monomers for enhanced durability.
  • Ultra mild acidity (pH > 3) allows for universal compatibility with dual-cured and self-cured mater.
  • Hydrophobic formula (resin friendly) results in improved durability of the bond.
  • Low film thickness allows the adhesive to readily flow into etched surfaces.
  • Clinical evaluation confirms the ease of use as a benefit leading to virtually nopost-operative sens
Exhibitor name: DENCO
Display stand B321 on the plan →